1）Cooperation with famous packaging factory which has more than 5 years experience in UV LED packaging 

2）Three kinds of packaging methods suitable for UV LED, the WPE continues to improve (A, quartz + ceramic substrate. B, ceramic substrate with internal reflection. C, nano-resin filler), At present, the highest WPE has been up to 8.62%, 275nm 100mA 50mW 5.8V 

3）Application of inorganic packaging to solve the problem of high temperature and high humidity (85 degrees 85 degrees humidity) under the harsh environment of the light beads resistance to bonding glue failure. High humidity (85 degrees 85 humidity) in harsh environments, to solve the problem of high brightness UV light on the bonding glue failure.

4) Customized COB mode, remove the bracket, increase the uniformity of the whole light-emitting surface, improve luminous efficiency.

5) Combined with the characteristics of the chip, can be customized 225-405nm, any 5nm UV LED lamp beads. Customizable 1mW-4000mW, any light intensity UV LED lamp beads, customizable 7°-140° angle UV LED lamp beads.